DuPont Nonwovens Introduces Tyvek Plus Envelope Substrate
DuPont Nonwovens, Wilmington, Del., has introduced Tyvek Plus envelope substrate, which features an absorbent surface and a stiffer sheet structure, enabling improved print quality and ease of handling.
Tyvek Plus offers the same qualities of traditional Tyvek strength—lightweight and durability—but is designed for ink jet printing of barcodes and other variable information printing. It also offers excellent results with offset litho and flexographic printing, producing high resolution and rich, bold colors. The improved surface characteristics and stiffer sheet structure of Tyvek Plus make envelopes easier to handle in both automated and manual processes.
For printers, the benefits of Tyvek Plus extend well beyond enhanced print quality; improved ease-of-use can lead to greater efficiencies. For medium- to high-volume mailers, such as direct mail houses and businesses in the financial industry, Tyvek Plus offers the added benefits of variable printing and improved handling in insertion processes. DuPont Tyvek Plus is also compatible with a broader variety of inks than traditional Tyvek.
For more information, visit www.dupont.com.